29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018


“It was excellent, from the content and from the organisation”

“Even if I think very hard I cannot come with any idea what could be improved at all”

“The catering was perfect”

Andreja Rojko, ECPE



“I really enjoyed taking part”

Stefan Oberhoff, Bosch

“Thank you for organizing the conference, I really enjoyed it very much!”

Daniel Beckmeier, Infineon



“Really, ESREF2018 was a great conference!”

Paolo Cova

“Indeed, it was a very interesting, and also very well organized, conference”

Paolo Mangone



“Very well organized ESREF conference”

Søren Jørgensen, Grundfos

“Thanks for organising the ESREF conference. It was a good one”

Jose Ortiz Gonzalez



“Thank you for this great conference. I enjoyed it a lot”

Shahriyar Kaboli

“You did a great job”

Giovanna Mura



“First keynote speaker is superb”

“Great presentations, good topics”

“The organisation was great”

Anonymous conference participants (on the 1st conference day)



“Highly interesting keynote from ITRS”

“The location has enough room for all the visitors”

“My favourite is the app”

Anonymous conference participants (on the 1st conference day)



“The food was good”

“Very interesting first day”

“Good overview of several subjects during tutorials”

Anonymous conference participants (on the 1st conference day)



“A nice event”

“Great opportunity to meet people from other countries and fields”

“It is very positive”

Anonymous conference participants (on the Young Professional Reception)



“Thanks to all the organization”

“Nice opportunity to network”

“I liked the setting”

Anonymous conference participants (on the Young Professional Reception)



“Very good”

“I have collected only positive experiences”

“Excellent”

Anonymous conference participants (on the 3rd conference day)



“It was my best dinner”

“Really it was a pleasure”

“The bus travel was greatly organised”

Anonymous conference participants (on the Gala Dinner)



“Interesting small stories around the castle”

“The location was wonderful”

“The idea with the historical touch was very entertaining”

Anonymous conference participants (on the Gala Dinner)



“Amazing!”

“Super fun!”

“Very nice!”

Anonymous conference participants (on the Gala Dinner)



“I really enjoyed the drinks, food and the best was maybe the organiser and the artists”

“A very nice, unique and original event – well done”

Anonymous conference participants (on the Gala Dinner)




Keynote Speeches

   
  Paolo Gargini - Chairman of International Roadmap for Devices and Systems (IRDS)
How to successfully overcome inflection points, or long live Moore's law
Details
   
  Philip Carne Kjær - Vestas Wind Systems A/S
Vestas' practice in reliability engineering for power electronics
Details
   

Invited Speeches

   
  Mehdi B. Tahoori - Karlsruhe Institute of Technology
Cross-Layer Approaches for Resilient VLSI System Design
Details
   
  Barry Linder - IBM Systems Group, Yorktown Heights, NY
The end of gate oxide scaling (for real this time)
Details
   
  Paul Pfaeffli - Synopsys Switzerland LLC
TCAD Modelling for Reliability
Details
   
  Frank Altmann - Fraunhofer IMWS, Center for Applied Microstructure Diagnostics CAM
Analytics for physics of failure in automotive applications
Details
   
  Nino Stojadinovic - University of Nis, Serbia
NBTI and Radiation Related Degradation and Lifetime Estimation in Power VDMOSFETs
Details
   
  Josef Lutz - Technische Universität Chemnitz, Germany
Reliability and reliability investigation of WBG power devices
Details
   
  Rajan Ambat - Technical University of Denmark
Interplay of humidity and electrical functionality imposing reliability problems in electronics
Details
   
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