29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018


“It was excellent, from the content and from the organisation”

“Even if I think very hard I cannot come with any idea what could be improved at all”

“The catering was perfect”

Andreja Rojko, ECPE



“I really enjoyed taking part”

Stefan Oberhoff, Bosch

“Thank you for organizing the conference, I really enjoyed it very much!”

Daniel Beckmeier, Infineon



“Really, ESREF2018 was a great conference!”

Paolo Cova

“Indeed, it was a very interesting, and also very well organized, conference”

Paolo Mangone



“Very well organized ESREF conference”

Søren Jørgensen, Grundfos

“Thanks for organising the ESREF conference. It was a good one”

Jose Ortiz Gonzalez



“Thank you for this great conference. I enjoyed it a lot”

Shahriyar Kaboli

“You did a great job”

Giovanna Mura



“First keynote speaker is superb”

“Great presentations, good topics”

“The organisation was great”

Anonymous conference participants (on the 1st conference day)



“Highly interesting keynote from ITRS”

“The location has enough room for all the visitors”

“My favourite is the app”

Anonymous conference participants (on the 1st conference day)



“The food was good”

“Very interesting first day”

“Good overview of several subjects during tutorials”

Anonymous conference participants (on the 1st conference day)



“A nice event”

“Great opportunity to meet people from other countries and fields”

“It is very positive”

Anonymous conference participants (on the Young Professional Reception)



“Thanks to all the organization”

“Nice opportunity to network”

“I liked the setting”

Anonymous conference participants (on the Young Professional Reception)



“Very good”

“I have collected only positive experiences”

“Excellent”

Anonymous conference participants (on the 3rd conference day)



“It was my best dinner”

“Really it was a pleasure”

“The bus travel was greatly organised”

Anonymous conference participants (on the Gala Dinner)



“Interesting small stories around the castle”

“The location was wonderful”

“The idea with the historical touch was very entertaining”

Anonymous conference participants (on the Gala Dinner)



“Amazing!”

“Super fun!”

“Very nice!”

Anonymous conference participants (on the Gala Dinner)



“I really enjoyed the drinks, food and the best was maybe the organiser and the artists”

“A very nice, unique and original event – well done”

Anonymous conference participants (on the Gala Dinner)




Call for Papers

ESREF 2018, the 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis will take place in Aalborg, Denmark from October 1 to 5, 2018. This international symposium will continue its almost 30-year history of focusing on the latest research developments and future directions in failure analysis, quality and reliability of materials, devices and circuits for micro-, opto-, power and space electronics. Historically, it provides an unpaired-quality European forum to develop all aspects of reliability, including management and advanced analysis techniques for present and emerging semiconductor applications. All aspects related to specification, technology and manufacturing, testing, control and analysis are addressed in ESREF.

SCOPE

  • Quality and Reliability assessment techniques and methods for Devices and Systems
  • Semiconductor Failure Mechanisms & Reliability
  • Progress in Failure Analysis: Defect Detection and Analysis
  • Reliability of Microwave and wide band-gap devices
  • Packaging and Assembly Reliability and Failure Analysis
  • Power Devices Reliability and Failure Analysis
  • Photonics Reliability
  • MEMS and sensors Reliability
  • Extreme environments
  • Renewable Energies Reliability
  • Modeling for Reliability
  • Reliability in Traction Applications

SUBMISSION GUIDELINES

Submitted four-page extended summaries should be written in English and include a front page with title, authors, affiliations, a five-line abstract, and the corresponding author complete address and e‑mail, along with the preference for oral or poster presentation. All the accepted oral and poster papers will be published in a special issue of Microelectronics Reliability journal (5-year impact factor: 1.623).

KEY DEADLINES

  • Submission of abstracts: 12 March 23 March 2018
  • Notification of acceptance: 2 May 2018
  • Submission of extended paper: 21 May 2018 31 May 2018
  • Registration of accepted papers: 31 May 2018

Download the CALL FOR PAPERS

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