29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018


“It was excellent, from the content and from the organisation”

“Even if I think very hard I cannot come with any idea what could be improved at all”

“The catering was perfect”

Andreja Rojko, ECPE



“I really enjoyed taking part”

Stefan Oberhoff, Bosch

“Thank you for organizing the conference, I really enjoyed it very much!”

Daniel Beckmeier, Infineon



“Really, ESREF2018 was a great conference!”

Paolo Cova

“Indeed, it was a very interesting, and also very well organized, conference”

Paolo Mangone



“Very well organized ESREF conference”

Søren Jørgensen, Grundfos

“Thanks for organising the ESREF conference. It was a good one”

Jose Ortiz Gonzalez



“Thank you for this great conference. I enjoyed it a lot”

Shahriyar Kaboli

“You did a great job”

Giovanna Mura



“First keynote speaker is superb”

“Great presentations, good topics”

“The organisation was great”

Anonymous conference participants (on the 1st conference day)



“Highly interesting keynote from ITRS”

“The location has enough room for all the visitors”

“My favourite is the app”

Anonymous conference participants (on the 1st conference day)



“The food was good”

“Very interesting first day”

“Good overview of several subjects during tutorials”

Anonymous conference participants (on the 1st conference day)



“A nice event”

“Great opportunity to meet people from other countries and fields”

“It is very positive”

Anonymous conference participants (on the Young Professional Reception)



“Thanks to all the organization”

“Nice opportunity to network”

“I liked the setting”

Anonymous conference participants (on the Young Professional Reception)



“Very good”

“I have collected only positive experiences”

“Excellent”

Anonymous conference participants (on the 3rd conference day)



“It was my best dinner”

“Really it was a pleasure”

“The bus travel was greatly organised”

Anonymous conference participants (on the Gala Dinner)



“Interesting small stories around the castle”

“The location was wonderful”

“The idea with the historical touch was very entertaining”

Anonymous conference participants (on the Gala Dinner)



“Amazing!”

“Super fun!”

“Very nice!”

Anonymous conference participants (on the Gala Dinner)



“I really enjoyed the drinks, food and the best was maybe the organiser and the artists”

“A very nice, unique and original event – well done”

Anonymous conference participants (on the Gala Dinner)




Technical Program Committee

Technical Program Chairs

  • M. CIAPPA - ETH Zurich, Switzerland
  • P. COVA - University of Parma, Italy
  • G. MENEGHESSO - University of Padua, Italy

Tracks in ESREF 2018

A - Quality and Reliability Assessment Techniques and Methods for Devices and Systems

  • Ninoslav STOJADINOVIC - University of Nis, Serbia
  • Cora SALM - UTwente, Netherland

B1 - Si-Technologies & Nanoelectronics: Hot Carriers, High-K, Gate Materials

  • Gabriella GHIDINI - STMicroeectronics, Italy
  • Alain BRAVAIX - ISEN-Toulon, France

B2 - Si Technologies & Nanoelectronics: Low-K, Cu Interconnects

  • Eckhard LANGER - Globalfoundries, Germany
  • Hervé JAOUEN - STMicroelectronics, France

B3 - Si-Technologies & Nanoelectronics: ESD, EMI and Latch-up

  • Gianluca BOSELLI - TI, USA
  • Marise BAFLEUR - LAAS, France

C - Progress in Failure Analysis: Defect Detection and Analysis

  • Giovanna MURA - University of Cagliari, Italy
  • Vladimir POPOK - Aalborg University, Denmark

D - Reliability of Microwave and Compound Semiconductors Devices

  • Nathalie LABAT - IMS Bordeaux, France
  • Michael DAMMANN - Fraunhofer IAF, Germany

E1 - Power Devices Reliability - Silicon and Passive

  • Reinhold BAYERER - Infineon, Germany
  • Huai WANG - Aalborg University, Denmark

E2 - Power Devices Reliability - Wide Bandgap Devices

  • Matteo MENEGHINI - University of Padova, Italy
  • Joachim WUERFL - FBH Germany

F - Packaging and Assembly Reliability

  • Kirsten WEIDE-ZAAGE - Hannover University, Germany
  • Rene RONGEN - NXP, Netherlands

G - MEMS, Sensors and Organic Electronics Reliability

  • Fabio COCCETTI - FIALAB, France
  • Stefan OBERHOFF - BOSCH, Germany

H - Photonics Reliability

  • Massimo VANZI - University of Cagliari, Italy
  • Alain BENSOUSSAN - IRT Saint Exupéry, France

I - Extreme Environments and Radiation

  • Simone GERARDIN - Università di Padova, Italy
  • Olivier CREPEL - Airbus, France

K - Renewable Energies Reliability

  • Salvo LOMBARDO - IMM CNR, Italy
  • Yongheng YANG - Alborg University, Denmark

L - Modeling for Reliability

  • Luca SPONTON - Synopsys, Switzerland
  • Susanna REGGIANI - University of Bologna, Italy

SS1 - Reliability in Traction Applications (Special Session)

  • Zoubir KHATIR - IFSTTAR, France
  • Hong LI - Beijing Jiaotong University, China
Powered by PMWiki
Visit statistic by Google Analytics