29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018


“I really enjoyed ESREF in Aalborg and was very pleased with all the arrangements and the overall logistical organization of the conference at this beautiful location. I should say it was a roaring success with a record number of submissions, exhibitors and a beautifully planned out program with adequate opportunities for technical interactions and social networking. I hope to attend ESREF more consistently in the years to come and look forward to more learning experiences there with different cultural connections to different parts of Europe!”

Nagarajan Raghavan (IPFA Co-Chair, SUTD, Singapore)



“I had a great time at ESREF 2018. I learned a lot from the technical talks especially on the GaN reliability. I got chance to network with many other researchers/engineers from academia and industries. The social event at Voergaard Castle was also very well organized, served with a great food and very entertaining shows. Overall, I can say ESREF 2018 was a great success. Congratulations to all the organizers! Looking forward to attend ESREF 2019”

Wardhana A. Sasangka (IPFA 2019 Technical Program Co-Chair/SMART, Singapore)



“It was excellent, from the content and from the organisation”

“Even if I think very hard I cannot come with any idea what could be improved at all”

“The catering was perfect”

Andreja Rojko, ECPE



“I really enjoyed taking part”

Stefan Oberhoff, Bosch

“Thank you for organizing the conference, I really enjoyed it very much!”

Daniel Beckmeier, Infineon



“Really, ESREF2018 was a great conference!”

Paolo Cova

“Indeed, it was a very interesting, and also very well organized, conference”

Paolo Mangone



“Very well organized ESREF conference”

Søren Jørgensen, Grundfos

“Thanks for organising the ESREF conference. It was a good one”

Jose Ortiz Gonzalez



“Thank you for this great conference. I enjoyed it a lot”

Shahriyar Kaboli

“You did a great job”

Giovanna Mura



“First keynote speaker is superb”

“Great presentations, good topics”

“The organisation was great”

Anonymous conference participants (on the 1st conference day)



“Highly interesting keynote from ITRS”

“The location has enough room for all the visitors”

“My favourite is the app”

Anonymous conference participants (on the 1st conference day)



“The food was good”

“Very interesting first day”

“Good overview of several subjects during tutorials”

Anonymous conference participants (on the 1st conference day)



“A nice event”

“Great opportunity to meet people from other countries and fields”

“It is very positive”

Anonymous conference participants (on the Young Professional Reception)



“Thanks to all the organization”

“Nice opportunity to network”

“I liked the setting”

Anonymous conference participants (on the Young Professional Reception)



“Very good”

“I have collected only positive experiences”

“Excellent”

Anonymous conference participants (on the 3rd conference day)



“It was my best dinner”

“Really it was a pleasure”

“The bus travel was greatly organised”

Anonymous conference participants (on the Gala Dinner)



“Interesting small stories around the castle”

“The location was wonderful”

“The idea with the historical touch was very entertaining”

Anonymous conference participants (on the Gala Dinner)



“Amazing!”

“Super fun!”

“Very nice!”

Anonymous conference participants (on the Gala Dinner)



“I really enjoyed the drinks, food and the best was maybe the organiser and the artists”

“A very nice, unique and original event – well done”

Anonymous conference participants (on the Gala Dinner)





Exhibitor




Booth 22
Fraunhofer IMWS and Fraunhofer IZM


Description
Fraunhofer IMWS-CAM is a leading service provider of failure diagnostics and material assessment for industry including semiconductor technologies, microelectronic components, microsystems and nanostructured materials. We consider the entire workflow from non-destructive defect localization over high precision target preparation to cutting-edge nanoanalytics supplemented by micro-mechanical testing, finite element modeling and numerical simulation. Our goal is to support cooperation partners in introducing innovative materials and technologies, improving manufacturing process steps, securing reliable field use of components, analyzing field returns, and consequently optimizing manufacturing yield, product quality, reliability, and cost efficiency. In addition, we are collaborating with suppliers of microstructure diagnostics and material testing equipment in developing innovative failure analysis methods and instrumentation, problem-adapted workflows for quality and reliability control, and new industry-compatible applications for future markets.

Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. Modern packaging technologies make developing smaller and smaller products possible. We process ICs thinner than a sheet of paper. The institute, founded in 1993, has a staff of more than 300 and disposes of a lab area of more than 8,000 sqm. More than 80 percent of our turnover in 2017 was earned through contract research.
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