29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018


“I really enjoyed ESREF in Aalborg and was very pleased with all the arrangements and the overall logistical organization of the conference at this beautiful location. I should say it was a roaring success with a record number of submissions, exhibitors and a beautifully planned out program with adequate opportunities for technical interactions and social networking. I hope to attend ESREF more consistently in the years to come and look forward to more learning experiences there with different cultural connections to different parts of Europe!”

Nagarajan Raghavan (IPFA Co-Chair, SUTD, Singapore)



“I had a great time at ESREF 2018. I learned a lot from the technical talks especially on the GaN reliability. I got chance to network with many other researchers/engineers from academia and industries. The social event at Voergaard Castle was also very well organized, served with a great food and very entertaining shows. Overall, I can say ESREF 2018 was a great success. Congratulations to all the organizers! Looking forward to attend ESREF 2019”

Wardhana A. Sasangka (IPFA 2019 Technical Program Co-Chair/SMART, Singapore)



“It was excellent, from the content and from the organisation”

“Even if I think very hard I cannot come with any idea what could be improved at all”

“The catering was perfect”

Andreja Rojko, ECPE



“I really enjoyed taking part”

Stefan Oberhoff, Bosch

“Thank you for organizing the conference, I really enjoyed it very much!”

Daniel Beckmeier, Infineon



“Really, ESREF2018 was a great conference!”

Paolo Cova

“Indeed, it was a very interesting, and also very well organized, conference”

Paolo Mangone



“Very well organized ESREF conference”

Søren Jørgensen, Grundfos

“Thanks for organising the ESREF conference. It was a good one”

Jose Ortiz Gonzalez



“Thank you for this great conference. I enjoyed it a lot”

Shahriyar Kaboli

“You did a great job”

Giovanna Mura



“First keynote speaker is superb”

“Great presentations, good topics”

“The organisation was great”

Anonymous conference participants (on the 1st conference day)



“Highly interesting keynote from ITRS”

“The location has enough room for all the visitors”

“My favourite is the app”

Anonymous conference participants (on the 1st conference day)



“The food was good”

“Very interesting first day”

“Good overview of several subjects during tutorials”

Anonymous conference participants (on the 1st conference day)



“A nice event”

“Great opportunity to meet people from other countries and fields”

“It is very positive”

Anonymous conference participants (on the Young Professional Reception)



“Thanks to all the organization”

“Nice opportunity to network”

“I liked the setting”

Anonymous conference participants (on the Young Professional Reception)



“Very good”

“I have collected only positive experiences”

“Excellent”

Anonymous conference participants (on the 3rd conference day)



“It was my best dinner”

“Really it was a pleasure”

“The bus travel was greatly organised”

Anonymous conference participants (on the Gala Dinner)



“Interesting small stories around the castle”

“The location was wonderful”

“The idea with the historical touch was very entertaining”

Anonymous conference participants (on the Gala Dinner)



“Amazing!”

“Super fun!”

“Very nice!”

Anonymous conference participants (on the Gala Dinner)



“I really enjoyed the drinks, food and the best was maybe the organiser and the artists”

“A very nice, unique and original event – well done”

Anonymous conference participants (on the Gala Dinner)





INVITED SPEECH
Paul Pfaeffli - Synopsys Switzerland LLC
TCAD Modelling for Reliability
Abstract
Technology Computer Aided Design (TCAD) tools can be used to effectively study and analyze a multitude of reliability issues in semiconductor devices. In the following article, we first describe Negative-Bias Temperature Instability (NBTI), which is one of the most severe reliability issues. Using the Reaction-Diffusion (RD) model for simulating the NBTI effect, we show that the simulated threshold voltage degradation agrees well with measured data. Based on the simulation results, we propose an on-chip heater to enhance recovery and revert the NBTI degradation. Next, we discuss how to apply the Hot-Carrier Stress (HCS) model to analyze hot carrier degradation in FinFET. We show that the threshold voltage shift agrees well with experiment and use the HCS model for the simulation of breakdown voltage walkout in a LDMOS transistor. Then, we apply process emulation to better understand modern DRAM structures and illustrate the row hammering reliability issue. Finally, we demonstrate a multi-level sub-modeling methodology for chip to package interaction (CPI) and apply the method to study the effect of wafer bending on the reliability of re-distribution layers (RDL).
Biography
Paul Pfaeffli studied Physics at ETH Zurich and received his Ph.D. degree from the Institute for Integrated Systems at ETH Zurich in 1999. Since 2007 he is Director of Application Engineering at Synopsys, responsible for TCAD customer support in Europe.
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